Topflight provides precision die-cutting on a variety of materials for electronic components. Our parts are produced on flexible converting equipment to tolerances as tight as ±0.001". Multi-layer constructions can virtually eliminate the need for conventional screws, rivets, or welds, and provide greater cushioning.
Various materials can be converted, from thin films and laminates at thicknesses of 0.001", to open and closed cell foams reaching thicknesses of 0.125", along with plastic, rubber, and even cloth. We also possess a wealth of experience with difficult challenges such as processing double-liner adhesive systems, converting thicker or softer adhesive systems, and providing adhesive-free zones.